Nt1310 Unit 2 Individual Assignment

Words: 1155
Pages: 5

An electronics hobbyist since second grade, invention and innovation are a second nature to me. As a tinkerer and maker with a massive collection of modules and components, I build gadgets around my home or simply experiment with recent technologies. At work too, I have been fortunate enough to have worked on multiple innovative, industry-first technologies that led to peer recognition by elevation to the senior member grade of IEEE.
Although involved in several product innovations and patents during my career, I consider process innovation to be more challenging and difficult because it is a collaborative team effort. Additionally, getting everyone to buy into a process change is another challenge. One such effort that I am particularly proud
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At this point, I was managing the entire portfolio of xDSL products in the other BU as the senior product line manager with additional charge of global field applications of all products across all business units.
Having just successfully released an industry first VDSL2 30a profile capable PHY that successfully completed carrier trials in Japan, my CEO asked me to take ownership of the DSP SoC product as well. At the time, I was not aware that plans were already afoot by the management to exit the broadband access business by selling the entire broadband access (xDSL) business unit to our biggest competitor, a move that would leave the DSP product as the flagship product for the remainder of the company. The stakes were extremely high, although I had no inkling about it.
After completing my initial analysis, my findings were that the product was incredibly complex in terms of silicon; hardware design; firmware and application software. Multiple classes of telecom equipment with differing requirements used the same product, so it had to cater to often conflicting requirements with chip variants and software